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Product Introduction

Overview​

The X8390 development board is designed around the MediaTek MT8390 platform. The MT8390 and MT8370 use pin-compatible packages, allowing the same carrier-board and core-module form factor to serve different performance targets.

  • MT8390 (Genio 700): 6nm process, two Cortex-A78 performance cores and six Cortex-A55 efficiency cores, Mali-G57 GPU, and a multi-core AI processor for edge-AI and industrial applications.
  • MT8370 (Genio 510): 6nm process, two Cortex-A78 and four Cortex-A55 cores, Mali-G57 MC2, APU, DSP, and HEVC encoding acceleration.

Front of the X8390 development board

Rear View​

Rear of the X8390 development board

System Configuration​

ItemSpecification
CPUMT8390; the carrier board also supports the MT8370 core module
MT8390 CPU2 × Cortex-A78 + 6 × Cortex-A55
ClockCortex-A78 at 2.2GHz; Cortex-A55 at 2.0GHz
RAM2GB / 4GB / 8GB
Storage4GB / 8GB / 16GB / 32GB / 64GB eMMC
PMICMT6365

Interfaces​

InterfaceSpecification
Power12V / 3A
DisplayOne MIPI DSI, one eDP, and one HDMI OUT
TouchCapacitive touch over I2C
AudioI2S / PCM / PDM, headphone, line input, speaker, and digital microphone
SD cardOne SDIO channel and an on-board TF-card socket
eMMCOn the core module; pins are not separately exposed on the carrier board
EthernetOne Gigabit Ethernet port
USBOne USB2.0 Type-A, one full-featured Type-C, and one Micro USB OTG
UARTTwo TTL UARTs
CameraOne MIPI CSI connector
PCIeOne expansion connector
Wi-Fi/BTM.2 AW-CB451NF with Wi-Fi 6 and Bluetooth 5.0

Mechanical Parameters​

ItemSpecification
Board dimensions145mm × 90mm × 1.6mm
Operating temperature0°C to 70°C
Storage temperature-10°C to 50°C

X8390 mechanical drawing