Reflow Temperature Profile

When the X6818Core Board is soldered through the reflow oven, the reflow oven temperature curve needs to be calibrated. The reflow oven itself has various solutions such as infrared reflow and vapor phase reflow, and the temperature calibration of different brands will be different. The following reflow parameters are for reference only. You can also refer to this reflow curve for other stamp hole Core Boards of the Jiuding brand.