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Product Introduction

Product Overview​

The X527CV2 is an eight-core Cortex-A55 core-board family based on the Allwinner T527/A527 series. Available pin-compatible variants include the T527N, T527, A527H, and A527M.

The 527 family supports DDR3, LPDDR3, DDR4, and LPDDR4(X), with CPU clocks up to 2GHz. Target applications include smart cockpits, surround-view systems, automated parking, edge computing, commercial displays, industrial control, and automotive electronics.

SoC Variants​

ModelCPU / NPUKey FeaturesTemperature Grade
T527N8 × Cortex-A55 at 2.0GHz, 2TOPS NPUFull-featured variantIndustrial, -40°C to 85°C
T5278 × Cortex-A55 at 2.0GHzNo NPUIndustrial, -40°C to 85°C
A527H8 × Cortex-A55 at 2.0GHz4K + 1080p independent HDMI displays; no NPU; one fewer CAN and DSP channelCommercial, -20°C to 75°C
A527M8 × Cortex-A55 at 1.8GHzCommercial variantCommercial, -20°C to 75°C
A523H8 × Cortex-A55 at 2.0GHzCommercial variantCommercial, -20°C to 75°C
A523M8 × Cortex-A55 at 1.8GHzCommercial variantCommercial, -20°C to 75°C

Core Board Features​

  • 55mm × 55mm dimensions.
  • PMU-based power management.
  • Support for multiple eMMC brands and capacities.
  • LPDDR4X memory with up to 4GB capacity.
  • Sleep and wake-up support.
  • Gigabit Ethernet, MIPI CSI, MIPI DSI, LVDS, RGB888, eDP, HDMI, PCIe, and USB3.0.
  • 200-pin castellated/stamp-hole package.
  • Pin-compatible T527N, T527, A527H, and A527M variants.

Appearance and Mechanical Drawings​

Front View​

Front view of the X527 core board

Rear View​

Rear view of the X527 core board

Top-Layer Mechanical Drawing​

Top-layer mechanical drawing of the X527 core board

Bottom-Layer Mechanical Drawing​

Bottom-layer mechanical drawing of the X527 core board

Specifications​

System Configuration​

CPUT527 / A527, Cortex-A55
Clock2GHz
RAM2GB / 4GB LPDDR4X
ROM4GB / 8GB / 16GB / 32GB / 64GB / 128GB / 256GB eMMC
PMICAXP717B with dynamic frequency scaling support

Interfaces​

LCDTwo LVDS, one eDP, and two MIPI interfaces selected by resistors
AudioIIS / PCM / PDM / SPDIF
SD cardTwo SDIO channels
eMMCOn-board eMMC; pins are not separately exposed
EthernetOne Gigabit Ethernet interface
USB Host 2.0Three ports
USB Host 3.0One port
UART16 channels
I2CThe source parameter table does not state the channel count
CameraThe parameter table lists one MIPI CSI input
HDMIOne HDMI2.0 TX
PCIeOne PCIe2.0 interface

Electrical Characteristics​

Input voltage/currentVCC-SYS, 5V / 3A
3.3V outputsDCDC4: 3.3V / 3A; CLDO3: 3.3V / 500mA
Operating temperature-20°C to 85°C; -40°C to 85°C option
Storage temperature-10°C to 50°C

Mechanical Parameters​

PackageCastellated/stamp-hole module
Dimensions55mm × 55mm × 1.2mm
Pin pitch1.0mm
Pin count200 pins
PCB layers8
WarpageLess than 0.5%